Sodium hypophosphite has excellent reducing effects on Ni, Au, Cu, etc., and is an important reducing agent in surface treatment processes such as electroless plating and electroplating. The sources of metal ions include nickel sulfate, nickel chloride, and copper sulfate. Electroless nickel plating involves processes like this. How to prepare the electroless plating solution, and how to use it effectively? These questions are closely related to the quality of the raw materials mentioned above. What is the reduction mechanism of sodium hypophosphite for nickel? Let's briefly discuss it below.

NaH2PO2·H2O is a +3 valent phosphorus salt with good reducing properties and stability. It also has excellent solubility in various aqueous solutions. Nickel in nickel sulfate and nickel chloride plays an important role in surface treatment, corrosion prevention, rust prevention, and gloss enhancement. How to convert nickel ions into metallic nickel is a crucial step in electroless nickel plating. Looking at the reaction formula below will reveal the mechanism of reduction of nickel sulfate and nickel chloride.

Ni²⁺+ H₂PO₂⁻+ 1H₂O → Ni + 1H₂PO₃⁻+ 2 H⁺

The above reaction only illustrates the reducing effect of sodium hypophosphite on nickel sulfate and nickel chloride. The specific ratio of these two components in the electroless plating solution, as well as the amount of other additives such as lactic acid and citric acid, will vary considerably depending on the composition and formulation of each electroless nickel plating solution.